Product Description
| Company Capability | |
|
Layers
|
1-40 layers
|
|
Copper Thickness
|
0.5-6 OZ
|
|
Material
|
 FR-4Copper, FPC, Ceramic, Aluminum-based, High Frequency, Thick Copper Board, Gold, Rogers, Taconic, Argon, Nalco, Isola, High TG. |
|
Solder Mask
|
 White.Black.Yellow.Green.Red.Blue |
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Finished Surface
|
conventional hasl, lead free hasl, immersion gold, immersion tin, immersion silver, hard gold, OSP…
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Min Solder Mask Bridge
|
0.08mm
|
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Plugging Vias capability
|
0.2-0.8mm
|
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Minimum Annlar Ring
|
4mil
|
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Max Copper thickness
|
UL certificated: 6.0 OZ |
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Minimum line width/gap
|
3.5/4mil(laser drill)
|
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Minimum hole size
|
0.15mm (mechanical drill) /4mil(laser drill)
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance Control
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Products Type
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High-frequency board, impendance controlled board, HDI board, BGA & Fine pitch board
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